Equipotential bonding shim
VDE 0100-410 stipulates equipotential bonding (colloquially also referred to as grounding). The equipotential bonding products pierce the nonconductive oxide layer of the module frames with their spikes and thus enable excellent conductivity of the connected components and thus perfect protective grounding.
Material
- 1.4301
 
Note
Only for module clamps
| Art. no. | Dimensions | Material | PU | EAN | 
|---|---|---|---|---|
| SOL100711 | 50 x 30 x 3,5 mm | 1.4301 | 40 | 4064827259436 | 

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